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  • There is no standard pinout for the TO-92.
  • Transistors and ICs of these types cannot handle as much power as higher-power equivalents, such as the TO-220, and can burn out quickly if they dissipate excessive power.
  • The main disadvantage of this style of case is the lack of heat sinking.
  • They are easy to find in small electronics stores because of their wide usefulness, making them a popular choice for hobby work and prototyping.
  • Most models are readily available in large quantities from wholesale distributors.
  • Transistors of this type can be made very inexpensively and take up very little board space.
  • The physical dimensions of the TO-92 housing may vary slightly depending on the manufacturer, however, the 1.27mm lead spacing must be respected. Otherwise, the leads may be bent manually however, care must be taken as they can break easily, as with any other device that is manually configured. Units with their leads pre-bent may be ordered to fit specific board layouts, depending on the application.

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    It is often convenient to bend them outward to a 0.10" (2.54 mm) spacing to make more room for wiring. The leads coming out of the case are spaced 0.05" (1.27 mm) apart. TO-92 packages with pre-bent wires on the left to emulate a TO-18 footprint (SO-97 in BS 3934, 10A3 in DIN 41868) Thus, "C1234" would likely be a 2SC1234 device, but "C547" is usually short for "BC547". If the face has a part name made up of only one letter and a few numbers, it can be either a Japanese or a Pro Electron part number. When looking at the face of the transistor, the leads are commonly configured from left-to-right as the emitter, base, and collector for 2N series (JEDEC) transistors, however, other configurations are possible, such as emitter, collector, and base commonly used for 2S series (Japanese) transistors or collector, base, and emitter for many of the BC series ( Pro Electron) types.

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    The leads protrude from the bottom of the case. A line of moulding flash from the injection-moulding process can be seen around the case. The case is molded around the transistor elements in two parts the face is flat, usually bearing a machine-printed part number (some early examples had the part number printed on the top surface instead). Construction and orientation Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3

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    The package is also known by the designation SOT54.īy 1966 the package was being used by Motorola for their 2N3904 devices among others. The JEDEC TO-92 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 92. The case is often made of epoxy or plastic, and offers compact size at a very low cost. The TO-92 is a widely used style of semiconductor package mainly used for transistors.















    Vce to open pdf